IBM at DAC: Learn new ways to accelerate EDA workloads

07 June, 2017
Peter Basmajian

When it comes to electronic design automation (EDA) technology, time-to-market is critical. Processor manufacturers are under intense pressure to deliver new chip generations that offer faster processing and greater reliability with higher efficiency. As a result, each new generation is more complex and has an increasing number of smaller components with increasing quantities of internal connections.

As a semiconductor design professional, are you keeping up with the latest tools and technologies? If you can learn more or refresh your skills, please join IBM at its free seminar Advanced Techniques for Managing EDA Workloads at the Design Automation Conference (DAC) on Wednesday, June 21 on level 3, room 10AB of the Austin Convention Center. Register here to reserve your seat, as this popular event will fill up quickly! We’ve updated the annual event agenda this year, formerly known as the IBM Spectrum LSF User Group, to include other high performance computing (HPC) technologies used in EDA including IBM Spectrum Scale, IBM Aspera Sync and IBM Spectrum LSF.

IBM Vice President of Electronic Design Automation Leon Stok, will discuss how IBM designs Power and Z microprocessors are using IBM Spectrum LSF, and you will hear from developers and engineers on how they increase operational efficiencies. That includes a case study featuring Ellexus Mistral at ASML Holding N.V., how to choose a parallel file system, and IBM Aspera solutions for scalable, multidirectional file replication and synchronization.

Hear from clients directly

In addition to in-depth technical sessions delivered by IBM’s product development team, clients will share their experience using IBM Spectrum Scale and IBM Spectrum LSF:

  • Senior Manager of Technical Computing Arthur Tseng, at MediaTek will offer a hybrid cloud case study for global static timing analysis.
  • Dragmic Nikolic, CAD Director at Cypress Semiconductor will describe how Cypress addresses filer bottlenecks
  • Brian Vandegriend, Product Verification Manager at Microsemi will describe how Microsemi uses IBM Spectrum LSF and Jenkins software to speed device driver delivery.

Manage the largest EDA workloads and transfer data globally

If you want to see hands-on demos of these tools, please visit IBM booth #1331 starting on June 19 and learn how IBM, its partners and clients accelerate design simulations, manage the largest EDA workloads and transfer big data globally. In addition to meeting IBM technical experts from these key technology areas, you’ll have a chance to learn more about Cypress Semiconductor and how they use IBM technologies to accelerate their design cycle, save cost and bring their designs to market faster.

More About DAC

The Design Automation Conference (DAC) is the premier conference for design and automation of electronic systems, and offers training, education, exhibits and networking opportunities for designers, researchers, tool developers and vendors. Attendees include design engineers and architects, CAD managers, senior executives and researchers from more than 1,000 organizations and universities. Close to 300 technical presentations and sessions are selected by a committee of electronic design experts offer information on recent developments and trends, management, new products and technologies.

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